Physical Failure analysis
Although semiconductor chips are small, their internal structure is very complex, especially the thousands of transistors in the microscopic unit at its core.
|
Analysis Technique |
Lateral Resolution |
|
STEM scanning transmission electron microscopy |
0.19nm |
|
TEM transmission electron microscopy |
0.24nm |
|
SEM SE SE Scanning EM Secondary Electronics |
0.6nm |
|
TEM-EDX lens energy spectrum |
1nm |
|
SEM BSE scanning electron microscopy backscattering |
1.8nm |
|
FIB focused ion beam |
4nm |
|
Auger Electronics |
8nm |
|
Laser microscopy |
>250nm |
|
Optical Microscopy |
>300nm |
|
SEM-EDX scanning electron microscopy energy spectrum |
>300nm |
|
3D Nano-CT high-resolution tomography |
0.9um |
|
X-Ray |
1um |
|
Stereo Microscopy asana microscopy |
>1um |