Surface analysis

The characteristics of the material, especially the composition and structural properties of the surface and interface at the microscopic scale. WinTech Nano has wide range of material analysis methods such as surface analysis, which can achieve high sensitivity, high precision quantitative analysis, which is widely used to study and analyze surface defects at the sub-micron and nanoscale level. By incorporating ion beam ablation, surface analysis applications can also be extended to 3D material analysis, providing technical support to a wide range of industries, such as the semiconductor industry, data storage, thin films, polymers and nanotechnology.

1. The surface analysis and testing content is as follows:

Surface analysis of inorganic and organic materials, contaminants or residues

Quantification of surface elemental composition

Determination of chemical status/bonding information

Depth analysis

Film/material and oxide thickness measurement

Line scan and area mapping

Second, the name and abbreviation of surface analysis technology:

Time-of-flight secondary ion mass spectrometry (TOF-SIMS) time-of-flight Secondary Ion Mass Spectrometry

Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)

X-ray photoelectron spectroscopy (XPS) X-ray photoelectron spectroscopy

Auger Electron Spectroscopy (AES).

Fourier Transform Infrared Spectroscopy (FTIR).

Total reflection X-ray fluorescence spectrometer (TXRF) X-Ray Fluorescence

Atomic Force Microscopy


Spectroscopy Ellipsometry

X-ray Diffraction (XRD) 

Transmission electron microscopy (TEM) Transmission Electron Microscopy

Field emission scanning electron microscopy (FE-SEM)

Energy dispersive X-ray spectrometry (EDX)

3. Main equipment

1. Atomic force microscope

By detecting the very weak interatomic interaction force between the surface of the sample to be measured and the tiny probe, the surface morphology, structure and properties of the substance are studied. The instrument has extremely high resolution for the analysis of sample surface roughness, down to or near atomic level. In addition to this, atomic force microscopy can perform various quantitative analyses of materials in different modes.

(1) Main equipment advantages

Minimum to 0.1nm depth resolution

A variety of application modules are expanded to meet different testing needs

Vacuum-adsorbed sample stage for measuring wafers up to 12 inches without destructive cutting

Tap mode test to accommodate flexible sample surfaces

(2) Test application introduction

Surface imaging/surface roughness testing

Nanoindentation surface hardness analysis

Microcurrent leakage detection

2. X-ray photoelectron spectroscopy XPS

X-ray photoelectron spectroscopy uses the binding energy and quantity of photoelectrons escaping from the range of 1 nanometer to 10nm below the surface of the X-ray excitation material, so as to obtain X-ray photoelectron spectroscopy to determine the elemental composition and elemental chemical and electronic states in the sample. With the help of ion beam ablation, X-ray photoelectron spectroscopy can also achieve depth profiling and is widely used in the analysis of thin film layers and interfaces.

(1) Main equipment advantages

Featuring the world’s first scan-focused X-ray source, it can analyze areas from as small as 7.5 microns

Obtain highly sensitive analytical data results

Fully automated analysis makes it easy to achieve automatic neutralization of insulating samples

High-performance depth analysis, 75mm*75mm stage

Fully automated and highly reliable measurement with optimal energy resolution of less than 0.48 eV (Ag3d5/2)

(2) Test application introduction

Material surface characterization

Elemental chemical valence

Depth testing of the film

(3) Introduction to material surface characterization

Signal source: 1-10nm below the surface.

Surface element/contaminant information is determined using a broad spectrum of 0-1300eV

Fine scanning is used to determine surface elemental/contaminant content

Energy resolution: ~0.48eV

Detection element range: Li~U

Detection accuracy: 0.1~1.0 at%

As samples may be affected by air pollutants during transport, Sembcorp Nano will provide surface analysis of the samples as they are situ and surface analysis after 5nm sputter cleaning

(4) Elemental chemical valence state

The peak splitting analysis was performed using the elemental sweep results to obtain the corresponding elemental chemical valence state.

Elemental valence states can be used for analysis: surface oxidation, halogen contamination, compound presumption.

By combining the analysis with the depth results, it can be used to estimate the thickness of the oxide layer.

(5) Film depth test

The sample is analyzed layer by layer by ion sputtering to peel off the outermost layer of the test area.

Analysis depth: 1-500nm

Sputtering depth accuracy: 1-10nm

Sputtering ion source: Argon ions

It can be used to estimate the oxide layer depth, doping content and depth, and analyze the film layer structure.