Surface analysis
The characteristics of the material, especially the composition and structural properties of the surface and interface at the microscopic scale. WinTech Nano has wide range of material analysis methods such as surface analysis, which can achieve high sensitivity, high precision quantitative analysis, which is widely used to study and analyze surface defects at the sub-micron and nanoscale level. By incorporating ion beam ablation, surface analysis applications can also be extended to 3D material analysis, providing technical support to a wide range of industries, such as the semiconductor industry, data storage, thin films, polymers and nanotechnology.
1. The surface analysis and testing content is as follows:
Surface analysis of inorganic and organic materials, contaminants or residues
Quantification of surface elemental composition
Determination of chemical status/bonding information
Depth analysis
Film/material and oxide thickness measurement
Line scan and area mapping
Second, the name and abbreviation of surface analysis technology:
Time-of-flight secondary ion mass spectrometry (TOF-SIMS) time-of-flight Secondary Ion Mass Spectrometry
Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)
X-ray photoelectron spectroscopy (XPS) X-ray photoelectron spectroscopy
Auger Electron Spectroscopy (AES).
Fourier Transform Infrared Spectroscopy (FTIR).
Total reflection X-ray fluorescence spectrometer (TXRF) X-Ray Fluorescence
Atomic Force Microscopy
Nano-indentation
Spectroscopy Ellipsometry
X-ray Diffraction (XRD)
Transmission electron microscopy (TEM) Transmission Electron Microscopy
Field emission scanning electron microscopy (FE-SEM)
Energy dispersive X-ray spectrometry (EDX)
3. Main equipment
1. Atomic force microscope
By detecting the very weak interatomic interaction force between the surface of the sample to be measured and the tiny probe, the surface morphology, structure and properties of the substance are studied. The instrument has extremely high resolution for the analysis of sample surface roughness, down to or near atomic level. In addition to this, atomic force microscopy can perform various quantitative analyses of materials in different modes.
(1) Main equipment advantages
Minimum to 0.1nm depth resolution
A variety of application modules are expanded to meet different testing needs
Vacuum-adsorbed sample stage for measuring wafers up to 12 inches without destructive cutting
Tap mode test to accommodate flexible sample surfaces
(2) Test application introduction
Surface imaging/surface roughness testing
Nanoindentation surface hardness analysis
Microcurrent leakage detection
2. X-ray photoelectron spectroscopy XPS
X-ray photoelectron spectroscopy uses the binding energy and quantity of photoelectrons escaping from the range of 1 nanometer to 10nm below the surface of the X-ray excitation material, so as to obtain X-ray photoelectron spectroscopy to determine the elemental composition and elemental chemical and electronic states in the sample. With the help of ion beam ablation, X-ray photoelectron spectroscopy can also achieve depth profiling and is widely used in the analysis of thin film layers and interfaces.
(1) Main equipment advantages
Featuring the world’s first scan-focused X-ray source, it can analyze areas from as small as 7.5 microns
Obtain highly sensitive analytical data results
Fully automated analysis makes it easy to achieve automatic neutralization of insulating samples
High-performance depth analysis, 75mm*75mm stage
Fully automated and highly reliable measurement with optimal energy resolution of less than 0.48 eV (Ag3d5/2)
(2) Test application introduction
Material surface characterization
Elemental chemical valence
Depth testing of the film
(3) Introduction to material surface characterization
Signal source: 1-10nm below the surface.
Surface element/contaminant information is determined using a broad spectrum of 0-1300eV
Fine scanning is used to determine surface elemental/contaminant content
Energy resolution: ~0.48eV
Detection element range: Li~U
Detection accuracy: 0.1~1.0 at%
As samples may be affected by air pollutants during transport, Sembcorp Nano will provide surface analysis of the samples as they are situ and surface analysis after 5nm sputter cleaning
(4) Elemental chemical valence state
The peak splitting analysis was performed using the elemental sweep results to obtain the corresponding elemental chemical valence state.
Elemental valence states can be used for analysis: surface oxidation, halogen contamination, compound presumption.
By combining the analysis with the depth results, it can be used to estimate the thickness of the oxide layer.
(5) Film depth test
The sample is analyzed layer by layer by ion sputtering to peel off the outermost layer of the test area.
Analysis depth: 1-500nm
Sputtering depth accuracy: 1-10nm
Sputtering ion source: Argon ions
It can be used to estimate the oxide layer depth, doping content and depth, and analyze the film layer structure.