1. Project description.

C-mode scanning acoustic microscope, through ultrasonic penetration of plastic encapsulation and ceramic encapsulation body, for detecting defects such as delamination or cavity void inside the sample. Different frequencies of the probe have different penetration depths, and different interfaces can be scanned by controlling the focus depth of the ultrasonic waves, together with two operating modes, reflective C-SAM and penetrating Through Scan. The device has a variety of sizes from 10 MHz-230 MHz, scanning modes A-Scan, B-Scan, C-Scan, Q-BAM, T-Scan, and supporting grayscale identification and pixel point calculation software for DIA software.

2. Application advantages.

Non-destructive analysis for rapid detection of internal delamination, voids, cracks and other defects.