1. Project introduction:

Electrostatic discharge (ESD) is one of the most important reliability issues in the integrated circuit (IC) industry. Typically, one-third to one-half of customer complaints are due to ESD or EOS failures. As circuit sizes become smaller and ESD damage becomes more common in new technologies, the effort to understand ESD faults through modeling and failure analysis increases.

What causes ESD to fail electronics? The main reasons are as follows:

Discharging the device, e.g. from the person to the device

Discharge from the device, discharge from a charged device to a human body or body with a low electrostatic potential

The electric field causes Field Induced Discharges, a field effect that causes current to flow through the components in the circuit

2. Application advantages:

Chip designers measure in the working state of complex chips, accurately find out the test parts of electrostatic weak circuits, test complex BGA chips, and automatically compare IV to determine PASS/NG. Through ESD testing, chip designers can design ICs with higher and better ESD grades.