Leading-edge analytical technology
Wintech Nano has a number of renowned experts in the semiconductor field, all of whom have an average of more than 10 years of experience in the industry, and more than 20 years of experience in failure analysis and reliability analysis and testing start-ups/services. By combining a team of world-class analysis technology experts with front-line semiconductor product experts, Wintech Nano has built a matrix structure of overseas and domestic technical teams to continuously develop new analysis and testing technologies and characterization methods, enabling the company to maintain its technological leadership in the industry.
At present, Wintech’s international expert analysis and testing team has obtained 20 authorized patents (more than 30 more patents are under application), published more than 80 papers in top international conferences and journals, registered 4 software copyrights, and participated in writing 2 books, and owns more than 100 self-developed world firsts in material analysis, failure analysis and reliability analysis technologies.
In addition, the company has a self-developed and original laboratory production management system. The system is designed to optimize the efficiency of the company’s operations and to achieve the three systems (automation, IT and informatization) in order to improve the company’s performance and customer service quality.
Wintech Nano
Published papers (Publications)
From 2014 – 2021
Summary
From 2014-2021, the company published total of 64 technical papers, 2 books and 1 trademark.
2014 (10 Papers)
1、Hua Younan, Xing Zhen Xiang and Li Xiaomin, Characterization Studies of Fluorine-induced Corrosion Crystal Defects on Microchip Al Bondpads Using X- ray Photoelectron Spectroscopy. the Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore, ID 88. p94-97 (2014).
2、Shen Yiqiang, Chen Yixin, Lee Hwangsheng, Chow Shueyin, Xing Zhenxiang, Hua Younan, Li Xiaomin, XPS and TEM Studies of Oxidation States on Sn Solder Ball. the Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 93, p127-130 (2014). 3、Chen Yixin, Hao Meng, Shao Jingjing, Lee Esther, Xin Qiuju, Song Lu, Li Kai, Lee Hwang Sheng, Shen Yiqiang, Xing Zhen Xiang, Khoo Bing Sheng, Chooi Meailing, Kon Cambridge, Zhou Yongkai, Feng Yang, Fu Chao, Hua Younan and Li Xiaomin, ATR-FTIR, DUEL BEAM SEM FIB and TOF-SIMS Studies on High Temperature and Moisture Induced “White Haze” Following the Pattern of Electrodes in Touch Panels. the Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 98, p135-138 (2014).
4、Yongkai Zhou, Younan Hua and Xiaomin Li, Spectrum Sharpening on Rotation Averaged TEM Nano Beam Electron Diffraction Patterns. the Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p152-155 (2014).
5、Chen Yixin, Emmanuel Simon, Bing Sheng Khoo, Esther Lee, Meailing Chooi, Hao Meng, Shao Jing Jing, Hua Younan and Li Xiaomin, A comprehensive investigation of the galvanic corrosion induced Ag-Al bonding degradation in microelectronic packaging using Ar ion milling, SEM, Dual Beam FIB-SEM. STEM and TOF-SIMS. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston. Texas, USA, p166-171 (2014).
6、Hua Younan, Chen Yixin, Zhou Yongkai, Fu Chao and Li Xiaomin, Failure Mechanism Studies and Root Cause Identification of Non-Stick on Pad on Microchip Al Bondpads. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas. USA, p219-221 (2014).
7、Shao Jingjing, Hua Younan, Shen Yiqiang, Lee Hwangshen, Zhou Yongkai, Xing Zhen Xiang, Hao Meng and Li Xiaomin, Al-Cu Alloy Films Characterization & amp; Studies using TOF-SIMS, XPS, AFM, EBSD & TEM. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014) , November 9-13, 2014, Houston, Texas, USA, p505-510 (2014).
8、Hua Younan, Chen Yixin, Shao Jingjing, Hao Meng, Shen Yue, Xing Zhenxiang, Feng Yang, Fu Chao and Li Xiaomin, Characterization Studies of Non-Stick On Pad (NSOP) Using AES, XPS and TOF-SIMS, 36th International Electronics Manufacturing Technology Conference (IEMT 2014) Renaissance Johor Bahru Hotel , Johor, Malaysia, November 11-13, 2014
9、Hua Younan, Shao Jingjing, Haomeng, An Wenwen, Xing Zhenxiang, Chen Yixin, Fu Chao and Li Xiaomin, TOF-SIMS Technique and Its Applications in Failure analysis and Material Analysis. the Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p75-83 (2014).
10、Shen Yiqiang, Hua Younan, Liu Yifei, Chen Yixin, Fu Chao and Li Xiaomin, Studies & Applications of the Standard Samples in Dynamic-SIMS Analysis. The Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p87-92 (2014).
2015 (3 Papers)
1、Hua Younan, Chen Yixin, Fu Chao and Li Xiaomin, Failure Mechanism Studies and Elimination of Galvanic Corrosion (Al-Cu Cell) on Microchip Aluminum Bondpads in Copper Process. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015. Portland, Ore. USA (2015).
2、Hua Younan, Shen Yue, Chen Yixin, Fu Chao and Li Xiaomin, Studies on a Qualification Method (OSSD) for Microchip Al Bondpads. the Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).
3、Yongkai Zhou, Shik Lin Lee, Chao Fu, Younan Hua and Xiaomin Li, Fault Isolation and TEM Study in State-Of-Art Thin-Film Transistors. the Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).