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Reliability Analysis

Reliability Analysis

  • Categories:Solutions
  • Time of issue:2022-12-16 21:45:09
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RA (Reliability) reliability testing can be carried out at the chip, board, module, system level. The purpose of reliability testing is to simulate the actual field use of a product through environmental testing and aging testing. Sembcorp's Nano Reliability Analysis Laboratory meets automotive-grade reliability and CPU reliability testing requirements.

RA detection purpose: to expose the product to natural or artificial environmental conditions to its effect, to evaluate the performance of the product under the actual use, transportation and storage environmental conditions, and to analyze and study the degree of influence of environmental factors and its mechanism of action.

RA mainly includes: high temperature working life test, low temperature working life test, constant temperature temperature and humidity test, alternating damp heat test, rapid temperature change test, hot and cold shock test, high acceleration life test, high pressure cooking test.

RA analysis benefit: Under the strength limit allowed by the design, the product uses acceleration skills to screen out the potential defects that have existed in the product, so as to avoid the failure of the product in the process of future use, resulting in unnecessary losses.

 

1. The relationship between environmental stress and failure

(1) The influence of temperature stress on the product

The product life generally adopts the "10°C rule", and the specific application can be expressed as:

When the ambient temperature rises by 10°C, the product life will be reduced by half; When the ambient temperature rises by 20°C, the product life is reduced to a quarter.

Effect of high temperature on products: aging, oxidation, thermal diffusion, electron migration, metal migration, melting, chemical changes and other reliability tests

The effect of low temperature on the product: embrittlement, icing, viscosity increase and solidification, mechanical strength reduction, physical shrinkage, etc.

(2) The effect of humidity on the product

On the specimen under high temperature and high humidity conditions, it can constitute water vapor adsorption, absorption and diffusion. Many materials expand after moisture absorption, the performance deteriorates, causing the material strength to decrease, and the insulating materials that adsorb water vapor will not only cause the deterioration of electrical properties, but also cause various failures under certain conditions, which is the most important failure environment affecting electronic products.

Effects of humidity on the product: corrosion, ion migration, hydrolysis, bursting, mold

(3) The impact of hot and cold temperature shock on products

High and low temperature failures are reflected in the hot and cold temperature shock test, which accelerates the occurrence of high temperature and low temperature failure.

The extreme increase in temperature leads to solder reflow;

When the motor is started, the temperature of the surrounding devices rises rapidly, and the temperature of the surrounding devices drops sharply when the motor is turned off;

The device is transferred from a warmer indoor to a relatively low-temperature outdoors, or from a relatively low-temperature outdoor to a higher-temperature interior;

The equipment may cool down suddenly due to rainfall;

The device is powered on in a low temperature environment, resulting in a rapid increase in temperature, or the power supply is cut off in a lower temperature environment, resulting in a rapid cooling of the device temperature;

When an aircraft takes off or lands, the temperature of the equipment on board the aircraft may change drastically.

 

2. Wintech Nano's ESD electrostatic testing capabilities

 

3. Reliability test items

 

(1)DPA: OM, X-Ray, CSAM/SAT, Section, Decap, SEM, EDX

Destructive physical analysis: visual inspection, X-ray inspection, ultrasonic scanning, sectioning, opening, scanning electron microscopy, energy spectroscopy

(2)Environmental: HTS, TC, HAST, PCT, Burn-In, Salt Spray

Environmental tests: high temperature storage, temperature cycle, accelerated stress, charged aging, salt spray

(3)Qualification: Solderability, Reflow, MSL, Bond Pull/Shear

Validation: Solderability, Reflow Soldering, Moisture-sensitive, Solder Joint Push-Pull Force

(4)EOS/ESD: ESD Gun, HBM MM CDM Latch-Up

Overload/Electrostatic: Electrostatic gun, mannequins, machine models, live devices, latch-up effect

 

4. Services we provide

 

We provide high-end material analysis, failure analysis and reliability analysis services, high-tech enterprises, universities and research institutes provide one-stop high-end analysis services, including high-tech and nanoscale material research and analysis and failure analysis and quality control of various high-tech products.

Industrial customers: semiconductor industry (wafer production, integrated circuits, chip design, packaging and testing, etc.), LCD LCD, LED display (traditional LED and organic LED), mobile phone touch screen TFT-LCD, hard disk manufacturing, nanomaterials (including metal materials, organic materials, ceramic materials, aerospace materials, etc.), petrochemical, biopharmaceutical, green energy and other industries.

Academic customers: all kinds of colleges and universities and research institutes, including professors leading national and provincial projects, scholars, master's, doctoral students and post-doctoral researchers who need to use high-end analytical methods in basic research and development projects.

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