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DPA

  • Categories:Test Services
  • Time of issue:2022-08-09 18:03:29
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Description:DPA analysis (Destructive Physical Analysis) is destructive physical analysis, referred to as DPA, to test component samples for non-destructive analysis and destructive analysis, randomly select 1%~2% or 2~5 samples to verify whether the design, structure, materials and manufacturing quality of components meet the requirements of the intended use or relevant specifications. DPA is one of the important methods of quality assurance of high-reliability components, which is mainly used for batch quality evaluation and is also suitable for quality control in the production process. DPA can find process defects in product design, structure, assembly and other processes that are not necessarily exposed in routine screening inspections.
Description:DPA analysis (Destructive Physical Analysis) is destructive physical analysis, referred to as DPA, to test component samples for non-destructive analysis and destructive analysis, randomly select 1%~2% or 2~5 samples to verify whether the design, structure, materials and manufacturing quality of components meet the requirements of the intended use or relevant specifications. DPA is one of the important methods of quality assurance of high-reliability components, which is mainly used for batch quality evaluation and is also suitable for quality control in the production process. DPA can find process defects in product design, structure, assembly and other processes that are not necessarily exposed in routine screening inspections.
Information

1. Project introduction

 

DPA analyzes benefits

 

Component manufacturers: understand product quality, improve product design process, and reduce business risks

System Integrator: Enhance procurement quality monitoring, eliminate early hazards, and improve product reliability

 

DPA's main analysis items:

 

1. Visual Inspection

2. X-ray inspection

3. Ultrasound examination C--SAM

4. Open Decap/Take DIE

5. Internal Inspection

6. Slice Cross-section

7. Electron microscopy SEM/EDAX

8. Pull Test

9. Bonding strength

10. Attachment strength

11. Terminal strength

12. Airproof Check

13. Integrity Inspection Passivation

14. Sampling with Microscop

15. Physical Check

16. Particle Noise PIND

17. Contact Check

18. Shear Strength Test Shear Test

 

DPA analysis flowchart

 

1

 

DPA different types of package analysis process


1

 

DPA is mainly analytical instruments and equipment

 

Optical Microscope

X-ray

Infrared microscope FTIR

Slice Cross section

Solder-ability

Peel strength

Stretch the tensile test

X-fluorescent surface thickness XRF/thickness

SEM/EDX spectroscopy of SEM/EDX

Shear/Pull test

SEM/EDX spectroscopy of SEM/EDX

Shear/Pull test

Thermomechanical/differential scanning analysis TMA/DSC(Tg, CTE, TD, cure factor)

Thermogravimetric analysis TGA(Td, moisture content)

Strain measurement (Heat sink process simulation)

Impedance TDR

Ultrasound scan SAT

Kaifeng De-cap

Electrical test LCR

 

The main analysis cases of DPA are as follows:

 

The case of the Hitachi SU5000 SEM

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