- Time of issue:2022-05-19 08:33:40
Reliability analysis is based on quantitative data for product quality, through experimental simulation, the probability of product performing specific specification functions within a given time and specific use environmental conditions, and successfully completing work objectives, and quantitative data as the basis for product quality assurance. Service life test is one of the basic test items of reliability analysis.
Lifetime testing is a method of studying the life characteristics of products, which can be performed in the laboratory to simulate various conditions of use. It is to put the product under specific test conditions to investigate its failure (damage) with time. Through the life test, the life characteristics, failure law, failure rate, average life and various failure modes that may occur during the life test can be understood. If combined with failure analysis, the main failure mechanism leading to product failure can be further clarified, which can be used as the basis for reliability design, reliability prediction, improvement of new product quality and determination of reasonable screening, routine (batch assurance) test conditions, etc. If the test can be carried out by increasing the stress without changing the failure mechanism in order to shorten the test time, this is an accelerated life test. Through the service life test, the reliability level of the product can be evaluated, and the reliability level of the new product can be improved through quality feedback.
HTOL high temperature life experiment
Experimental purpose: The high temperature life test is to accelerate the failure mechanism activated by temperature in the bias state. Prior to HTOL, all test samples were subjected to standard electrical tests at low and high temperatures and burned beforehand. Dynamic operating conditions are suitable for most situations, and the test circuit depends on the specific device. The typical stress voltage is 1.1 times the normal operating voltage. Unless otherwise specified, the stress temperature is maintained at 125°C. The device is tested at a defined point in time. The failure rate is calculated in FITs (Time to Failure). Each FIT represents one failure per 109 device hours.
|Temperature description||Each test device is individually temperature controlled up to 150W and up to 150°C.||Each test device is individually temperature controlled up to 50W and up to 150°C.|
|Number of power||16||10|
|Number of slots||16||32|
|Time/Pass||1000hrs 77ea/ 0 Fail||1000hrs 77ea/ 0 Fail|
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