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Physical Failure analysis

Physical Failure analysis

  • Categories:Solutions
  • Time of issue:2022-05-18 17:58:56
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Description:
Description:
Information

Although semiconductor chips are small, their internal structure is very complex, especially the thousands of transistors in the microscopic unit at its core.

Analysis Technique

Lateral Resolution

STEM scanning transmission electron microscopy

0.19nm　

　TEM transmission electron microscopy

0.24nm　

　SEM SE SE Scanning EM Secondary Electronics

0.6nm　　

TEM-EDX lens energy spectrum

1nm

SEM BSE scanning electron microscopy backscattering

1.8nm　　

FIB focused ion beam

4nm

Auger Electronics

8nm　

Laser microscopy

>250nm　

　Optical Microscopy 

 >300nm　　

SEM-EDX scanning electron microscopy energy spectrum

>300nm　　

3D Nano-CT high-resolution tomography

0.9um　

X-Ray

1um　

　Stereo Microscopy asana microscopy

 >1um

　

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