- Time of issue:2022-05-18 17:24:00
Non-destructive testing, or Non-destructive Testing, is a technical operation to obtain information about internal defects without damaging the surface of the workpiece or affecting its service life. Conventional non-destructive ultrasound scanning SAT, X-ray Roentgen rays, CT tomography, TDR, etc.
1. C-mode scanning acoustic microscope (C-SAM)
Through ultrasonic penetration of plastic packaging and ceramic package, used to detect defects such as layered delamination or hole void inside the sample, probes of different frequencies have different penetration depths, and different interfaces can be scanned by controlling the focusing depth of ultrasonic waves, and with the two working modes of reflective C-SAM and penetrating Through Scan.
(1) Equipment parameters
10MHz-300 MHz in a variety of sizes
Scan modes: A-Scan, B-Scan, C-Scan, Q-Scan, T-Scan
Supporting grayscale recognition and pixel calculation software: DIA software
(2) Non-destructive testing, which can quickly detect internal delamination, cavities, cracks and other defects.
X-ray uses a cathode ray tube to generate high-energy electrons and metal targets, and during the impact, due to the sudden slowdown of electrons, the lost kinetic energy will be released in the form of X-Ray. For locations where the sample cannot be observed in an outward way, the contrast effect produced by X-Ray can form an image that shows the internal structure of the analyte without destroying the analyte, and then the problematic area inside the analyte can be observed without destroying the analyte.
X-Ray imaging resolution is higher, and the company has more equipment, and the delivery time is relatively fast. It can do SMT BGA soldering bubble detection, PCB through-hole measurement, wafer-level packaging Bump TSV measurement, module internal structure.
3. 3D X-Ray
Ultra-high resolution 3DX-RAY microscope is a non-destructive X-ray fluoroscopy technology, combined with optical objective lens to increase magnification for experimental detection, the experimental process is to fix the object to be measured and rotate 360°, in this process to collect 2D penetration images from different angles, and then use computer computing to reconstruct the solid image of the object to be measured.
It can be applied to electronic components, integrated circuit packaging, PCB circuit boards, wafer packaging, sensors, failure analysis. Full-scale mapping, connector interfaces, plastic models, automotive and aerospace parts, cables, toys, etc. Materials Science, Precision Injection Molding, Micromechanics, Electronic Geology and Biology.
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