- Categories:Test Services
- Time of issue:2022-05-18 16:54:34
1. Project introduction:
X-ray photoelectron spectroscopy uses the binding energy and quantity of photoelectrons escaping from the range of 1 nanometer to 10 nanometers below the surface of the X-ray excitation material, so as to obtain X-ray photoelectron spectroscopy to determine the elemental composition and elemental chemical and electronic states in the sample. With the help of ion beam ablation, X-ray photoelectron spectroscopy can also achieve depth profiling and is widely used in the analysis of thin film layers and interfaces. Sembcorp Nano has the world's highest performance XPS photoelectron spectroscopy, providing superior capabilities for automated analysis of small areas.
Featuring the world's first scan-focused X-ray source, it can analyze areas from as small as 7.5 microns
Obtain highly sensitive analytical data results
Fully automated analysis makes it easy to achieve automatic neutralization of insulating samples
High-performance depth analysis, 75x75mm stage
Fully automated and highly reliable measurement with optimal energy resolution of less than 0.48 eV (Ag3d5/2)
X-ray photoelectron spectroscopy XPS is mainly used in material surface characterization, elemental chemical valence state, and film depth testing;
(1) Material surface characterization
Signal source: 1-10nm below the surface.
Surface element/contaminant information is determined using a broad spectrum of 0-1300eV.
Fine scanning is used to determine surface elemental/contaminant content.
Energy resolution: ~0.48eV
Detection element range: Li~U
Detection accuracy: 0.1~1.0 at%
As samples may be affected by air pollutants during transport, Sembcorp Nano will provide surface analysis of the samples as they are situ and surface analysis after 5nm sputter cleaning
(2) Elemental chemical valence
The peak splitting analysis was performed using the elemental sweep results to obtain the corresponding elemental chemical valence state.
Elemental valence states can be used for analysis: surface oxidation, halogen contamination, compound presumption.
By combining the analysis with the depth results, it can be used to estimate the thickness of the oxide layer.
(3) Film depth test
The sample is analyzed layer by layer by ion sputtering to peel off the outermost layer of the test area.
Sputtering depth: 1-500nm
Sputtering depth accuracy: 1-10nm
Sputtering ion source: argon ions
It can be used to estimate the oxide layer depth, doping content and depth, and analyze the film layer structure.
2. Application cases:
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