Leading-edge analytical technology

Wintech Nano has a number of renowned experts in the semiconductor field, all of whom have an average of more than 10 years of experience in the industry, and more than 20 years of experience in failure analysis and reliability analysis and testing start-ups/services. By combining a team of world-class analysis technology experts with front-line semiconductor product experts, Wintech Nano has built a matrix structure of overseas and domestic technical teams to continuously develop new analysis and testing technologies and characterization methods, enabling the company to maintain its technological leadership in the industry.

At present, Wintech's international expert analysis and testing team has obtained 20 authorized patents (more than 30 more patents are under application), published more than 80 papers in top international conferences and journals, registered 4 software copyrights, and participated in writing 2 books, and owns more than 100 self-developed world firsts in material analysis, failure analysis and reliability analysis technologies.

In addition, the company has a self-developed and original laboratory production management system. The system is designed to optimize the efficiency of the company's operations and to achieve the three systems (automation, IT and informatization) in order to improve the company's performance and customer service quality.

Wintech Nano

Published papers (Publications)

From 2014 - 2021

Summary

From 2014-2021, the company published total of 64 technical papers, 2 books and 1 trademark.

2014 (10 Papers)

1、Hua Younan, Xing Zhen Xiang and Li Xiaomin, Characterization Studies of Fluorine-induced Corrosion Crystal Defects on Microchip Al Bondpads Using X- ray Photoelectron Spectroscopy. the Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore, ID 88. p94-97 (2014).

2、Shen Yiqiang, Chen Yixin, Lee Hwangsheng, Chow Shueyin, Xing Zhenxiang, Hua Younan, Li Xiaomin, XPS and TEM Studies of Oxidation States on Sn Solder Ball. the Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 93, p127-130 (2014). 3、Chen Yixin, Hao Meng, Shao Jingjing, Lee Esther, Xin Qiuju, Song Lu, Li Kai, Lee Hwang Sheng, Shen Yiqiang, Xing Zhen Xiang, Khoo Bing Sheng, Chooi Meailing, Kon Cambridge, Zhou Yongkai, Feng Yang, Fu Chao, Hua Younan and Li Xiaomin, ATR-FTIR, DUEL BEAM SEM FIB and TOF-SIMS Studies on High Temperature and Moisture Induced "White Haze" Following the Pattern of Electrodes in Touch Panels. the Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 98, p135-138 (2014).

4、Yongkai Zhou, Younan Hua and Xiaomin Li, Spectrum Sharpening on Rotation Averaged TEM Nano Beam Electron Diffraction Patterns. the Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p152-155 (2014).

5、Chen Yixin, Emmanuel Simon, Bing Sheng Khoo, Esther Lee, Meailing Chooi, Hao Meng, Shao Jing Jing, Hua Younan and Li Xiaomin, A comprehensive investigation of the galvanic corrosion induced Ag-Al bonding degradation in microelectronic packaging using Ar ion milling, SEM, Dual Beam FIB-SEM. STEM and TOF-SIMS. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston. Texas, USA, p166-171 (2014).

6、Hua Younan, Chen Yixin, Zhou Yongkai, Fu Chao and Li Xiaomin, Failure Mechanism Studies and Root Cause Identification of Non-Stick on Pad on Microchip Al Bondpads. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas. USA, p219-221 (2014).

7、Shao Jingjing, Hua Younan, Shen Yiqiang, Lee Hwangshen, Zhou Yongkai, Xing Zhen Xiang, Hao Meng and Li Xiaomin, Al-Cu Alloy Films Characterization & amp; Studies using TOF-SIMS, XPS, AFM, EBSD & TEM. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014) , November 9-13, 2014, Houston, Texas, USA, p505-510 (2014).

8、Hua Younan, Chen Yixin, Shao Jingjing, Hao Meng, Shen Yue, Xing Zhenxiang, Feng Yang, Fu Chao and Li Xiaomin, Characterization Studies of Non-Stick On Pad (NSOP) Using AES, XPS and TOF-SIMS, 36th International Electronics Manufacturing Technology Conference (IEMT 2014) Renaissance Johor Bahru Hotel , Johor, Malaysia, November 11-13, 2014

9、Hua Younan, Shao Jingjing, Haomeng, An Wenwen, Xing Zhenxiang, Chen Yixin, Fu Chao and Li Xiaomin, TOF-SIMS Technique and Its Applications in Failure analysis and Material Analysis. the Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p75-83 (2014).

10、Shen Yiqiang, Hua Younan, Liu Yifei, Chen Yixin, Fu Chao and Li Xiaomin, Studies & Applications of the Standard Samples in Dynamic-SIMS Analysis. The Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p87-92 (2014).

2015 (3 Papers)

1、Hua Younan, Chen Yixin, Fu Chao and Li Xiaomin, Failure Mechanism Studies and Elimination of Galvanic Corrosion (Al-Cu Cell) on Microchip Aluminum Bondpads in Copper Process. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015. Portland, Ore. USA (2015).

2、Hua Younan, Shen Yue, Chen Yixin, Fu Chao and Li Xiaomin, Studies on a Qualification Method (OSSD) for Microchip Al Bondpads. the Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

3、Yongkai Zhou, Shik Lin Lee, Chao Fu, Younan Hua and Xiaomin Li, Fault Isolation and TEM Study in State-Of-Art Thin-Film Transistors. the Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

2016 (8 Papers)

1、Hua Younan, Hua Younan, Khoo Bingsheng, Henry Leong, Chen Yixin, Chan Eason, Wang Jingyuan and Li Xiaomin. studies on a Novel Qualification Method of Silicon Nitride Layer The Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016), November 6-10, 2016, Fort Worth Convention Centre, Fort Worth Worth Convention Centre, Fort Worth, TX, USA (2016).

2、Hua Younan, Studies and Application of Auger Monitoring System for Quality Control and Assurance of Al Bondpads. the Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016), November 6-10, 2016, Fort Worth Convention Centre, Fort Worth, TX, USA (2016).

3、Hua Younan, Shen Yue, Niu Zilu, Chen Yixin and Li Xiaomin, Studies and Applications of SIMS (D-SIMS and TOF-SIMS) in Contamination Analysis. the proceedings of the 6th National SIMS Symposium, 08-12 October, Dalian, China, p21-23 (2016).

4、Hua Younan, Shen Yue, Niu Zilu, Wu Junxian, Erika Therese S. Abella, Khoo Bingchao, Chen Yixin and Li Xiaomin, Applications of TOF-SIMS and XPS in Failure Analysis and Material Characterization. the proceedings of the 6th National SIMS Symposium, 08-12 October, Dalian, China, p36-38 (2016).

5、Hua Younan, Fuchao, Shen Yue, Shan Yuqin, Chen Yixin and Li Xiaomin, Studies and Applications of SEM/EDX, XPS and AES in Failure Analysis and Material Characterization. the proceedings of the CTEX and PCB Conference, 18-20 May, Suzhou, China (2016).

6、Hua Younan, Shen Yue, Li Kai, Wang Jing Yuan, Chan Yong Shen, Chen Yixin, Fu Chao and Li Xiaomin. Studies on XPS Valence State Analysis of Copper Materials. The proceedings of the 37th International Electronics Manufacturing Technology (IEMT) - 18th Electronics Materials & Packaging (EMAP ) Conference, 20-22 September 2016, G-Hotel, Penang, Malaysia, B2.3 (2016).

7、Hua Younan, Shen Yue, Shan Yuqin,, Chen Yixin, Fu Chao and Li Xiaomin. application of XPS and TOF-SIMS in Failure Analysis and Characterization of Aluminum Fluoride Defects on Microchip Al Bondpads. the proceedings of the National Surface Analysis Symposium, 10-12 Aug, 2016, Kunming, China (2016) .

8、Yixin Chen, Younan Hua, Bing Sheng Khoo, Henry Leong, Vanie Bagulbagul, Yansong Wang, Yanlin Pan, Eason Chan, Maohua Chen, Jing Yuan Wang, Yue Shen. Zilu Niu, Jun Xian Goh, Erika Therese S. Abella and Xiaomin Li Comprehensive Physical and Chemical Characterization of the Galvanic Corrosion Induced Failures. Failures. the Proceedings of the 23rd International Physics and Failure Analysis (IPFA2016), July 2016, Singapore, 191 (10B.4), (2016).

2017 (7 Papers)

1、Hua Younan, Karen Toh, Shen Yue, Khoo Bingsheng and Li Xiaomin. Studies of TEM/EDX Data Process and Application in Identification of Cu Oxide Compounds, The Proceedings of the 24th International Physics and Failure Analysis (IPFA2017), July 2017, Chengdu, China (2017).

2、Hua Younan. Studies of Al Bondpad Qualification Methodologies and Application in Backend Process Optimization and Improvement in Wafer Fabrication. The Proceedings of the 24th International Physics and Failure Analysis (IPFA2017), July 2017, Chengdu, China (2017).

3、Hua Younan, Shen Yue, Shan Yuqin,, Fu Chao and Li Xiaomin. Application of XPS and TOF-SIMS in Failure Analysis and Characterization of Aluminum Fluoride Defects on Microchip Al Bondpads and Studies of Failure Mechanism. the proceedings of the 2017 National Conference on Surface Science and Technology, 11-13 Aug, 2017, Shantou University, Shantou, China (2017).

4、Hua Younan. Auger/SEM/EDX Analysis and Failure Mechanism Study of Aluminum Bromide Defects in Wafer Fabrication. the proceedings of the 2017 National Conference on Surface Science and Technology, 11-13 Aug, 2017, Shantou University, Shantou, China (2017).

5、Hua Younan, Shen Yue, Khoo Bingsheng and Li Xiaomin, Studies of Surface Analysis Techniques and Applications in Material Characterization and Failure Analysis, PSECE 2017 - 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) - Paper 23-1600, 21-23 June 2017, SMX Convention Center, Manila, Philippines (2017).

6、Hua Younan. NSOP Problem and Failure Mechanism Studies. PSECE 2017 - 14th Philippine Semiconductor and Electronics Convention and Exhibition ( PSECE) - Paper 23-1600, 21-23 June 2017, SMX Convention Center, Manila, Philippines (2017).

7、Hua Younan. Studies of Fluorine-induced Corrosion and Defects on Microchip Al Bondpads and Auger Monitoring for Quality Control and Assurance. SSEA17, SEMICON Southeast Asia, Penang, Malaysia (2017).

2018 (11 Papers)

1、Wang Bisheng, Lois Liao Jinzhi and Li Xiaomin. characterization of interfacial intermetallic compounds in gold wire bonding with copper pad. IEEE 20th Electronics Packaging Technology Conference, Singapore, p1-5 (2018).

2、Hua Younan, Can We Use EDX To Determine Fluorine Contamination Level on A Normal Al Bondpad? The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

3、Che Yan, Niu Zilu, Hua Younan and Li Xiaomin, A TOF-SIMS investigation of the corrosion-induced failure via grain boundaries in polycrystalline materials. the Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

4、Hua Younan, Wu Mengxue, Niu Zilu, Liu Jiahui, Erika Therese S. Abella,Khin Yin Pang,Shenyue and Li Xiaomin, Studies of Secondary Ion Mass Spectrometry (D-SIMS and TOF-SIMS) and Its Applications in Failure Analysis of Semiconductor, Wafer Fabrication and Packaging, the 7th China SIMS Spectrometry (D-SIMS and TOF-SIMS) and Its Applications in Failure Analysis of Semiconductor, Wafer Fabrication and Packaging, the 7th China SIMS Conference, 08-12, Oct 2018, Suzhou(2018).

5、Hua Younan, Shenyue, Niu Zilu, Goh Junxian, Erika Therese S. Abella, Khin Yin Pang and Li Xiaomin, X-ray Photoelectron Spectroscopy (XPS) and Time-of-flight Secondary Ion Mass Spectrometry (TOF-SIMS) combined application for quantitative analysis of Phosphorus and Boron, the 7th China SIMS -flight Secondary Ion Mass Spectrometry (TOF-SIMS) combined application for quantitative analysis of Phosphorus and Boron, the 7th China SIMS Conference, 08-12, Oct 2018, Suzhou(2018).

6、Hua Younan, Liang Qichao, Shenyue, Sun Jie and Li Xiaomin, Studies of AES and Application in Monitoring Fluorine Contamination and Quality Control of Al Bondoads of Wafer Fabrication. the Proceedings of the 2018 NMSSA 2018, 12-15, Oct 2018, Suzhou, China (2018).

7、Hua Younan, Niu Zilu, Erika Therese S. Abella, Khin Yin Pang,Zhang Nan and Li Xiaomin, Time of Flight Secondary Ion Mass Spectrometry (TOF-SIMS) and Its Application in Biological Sample Analysis and Research. the proceedings of the 2018 NMSSA 2018, 12-15, Oct 2018, Suzhou, China (2018).

8、Hua Younan, Shenyue, Goh Junxian, Kee Yehyee and Li Xiaomin, Qualification of Microchip Al Bondpad and Elimination of NSOP, The Proceedings of IEMT Conference 2018, 04-06 Sept 2018, Malaysia.

9、Lois Liao Jinzhi; Chen Yan; Wang Bisheng; Li Xiaomin; Fu Chao; Hua Younan, A Review on the Copper Bond Pad Application in Wire Bond Technique,, The 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 IEEE , 08-11 Aug, Shanghai, China (2018).

10、Binghai Liu, Younan Hua, Zhili Dong, Pik Kee Tan,Yuzhe Zhao, Zhiqiang Mo,Jeffrey Lam, Zhihong Mai, The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM, The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018. Singapore (2018).

11、Binghai Liu, Zhi Li Dong, Younan Hua, Chao Fu, Xiaomin Li, Pik Kee Tan, and Yuzhe Zhao Electron-beam radiation induced degradation of silicon nitride and its impact to semiconductor failure analysis by TEM, AIP Advances vol. 8, 115327 (2018).

2019 (9 Papers)

1、lois Liao Jinzhi, Song Jianbo, Zhu Lei, Chen Yan, Cho Nan, Yao Qinghong, Fu Chao, Hua Younan and Li Xiaomin, A study on an abnormal oxidation issue of copper bonding wire. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 115; July 2019, Hangzhou, China (2019).

2、Wang Bisheng, Lois Liao Jinzhi, Zhang Xi, Li Xiaomin, Hua Younan, Tee Weikok, Yee Boonhwa and Mao Songlin, Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 156; July 2019. Hangzhou, China (2019).

3、Hua Younan. How To Determine Fluorine Contamination Level On A Normal Al Bondpad? The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 199; July 2019, Hangzhou, China (2019).

4、Mengxue Wu, Lei Zhu, Jiahui Liu, Younan Hua and Xiaomin Li, Study of cross contamination between InP substrate and Silicon substrate during Phosphors The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 243; July 2019, Hangzhou, China ( 2019).

5、Tan HK, Liu BH, Hua YN and Li XM, Study of Silicon thickness for electron transparency transparency, The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 310; July 2019, Hangzhou, China (2019).

6、Hua Younan, Studies of Advanced Failure Analysis Techniques and Applications in Advanced Packaging Devices and Product & System Level Test Processing. SSEA2019, SEMICON Southeast Asia, Kuala Lumpur, Malaysia (2019).

7、Lois Liao Jinzhi, Zhang Xi, Wang Bisheng, Li Xiaomin, Hua Younan, Fu Chao, Tee Weikok, Yee Boonhwa and Mao Songlin, Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations. the Proceedings of the ICICDT conference; 17-19 June 2019, Suzhou, China ( 2019).

8、Hua Younan, Studies of characterization and analysis methodologies of Al bondpads and applications in wafer fabrication and assembly processes. The proceedings of the NMSSA 2019, 11-14 August 2019, Chengdou, China, p33 (2019).

9、Hua Younan, Xu Ke, Kee Yehyee, Zhu Lei and Li Xiaomin, Studies and Applications of AFM in material chacterization and failure analysis. the proceedings of the NMSSA 2019, 11-14 August 2019, Chengdou, China, p52 (2019).