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- Time of issue:2022-05-18 14:01:49
As an independent third-party analysis lab and R&D partner, Wintech Nano has high-end laboratory analysis and R&D capabilities and has been collaboration with world-leading companies, actively participating in a number of semiconductor advanced process R&D projects. The R&D team understand customer requirements and background of the project case, provides the extensive analysis report directly to the customer with solutions. With effectively assists in designing equipment or products, resulting in a number of classic cases of globalized industrial chain division of labor and cooperation in semiconductor industry development, fully verifying the feasibility of Labless new generation business potential.
Through nearly 20 years of analysis and testing, Wintech Nano has built up a large database of over 6 million and has more than 100 original analysis technologies in the world, accumulating comprehensive analysis capabilities in the whole industry chain in the fields of semiconductor wafer manufacturing, integrated circuit chip packaging, new materials for automotive electronics, new energy, chemical and chemical industry, geology and minerals. In the future, Wintech Nano will continue to strengthen the in-depth cooperation with the semiconductor industry chain, effectively protect the interests of customers and ensure information security and look forward to working with more partners to help the benign development of the industry.
Wintech Nano collaborates with world-renowned companies
Jointly published papers (Publications)
1、Wang Bisheng, Lois Liao Jinzhi and Li Xiaomin. characterization of interfacial intermetallic compounds in gold wire bonding with copper pad. IEEE 20th Electronics Packaging Technology Conference, Singapore, p1-5 (2018).
2、Lois Liao Jinzhi; Chen Yan; Wang Bisheng; Li Xiaomin; Fu Chao; Hua Younan, A Review on the Copper Bond Pad Application in Wire Bond Technique,, The 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 IEEE , 08-11 Aug, Shanghai, China (2018).
1、Wang Bisheng, Lois Liao Jinzhi, Zhang Xi, Li Xiaomin, Hua Younan, Tee Weikok, Yee Boonhwa and Mao Songlin, Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 156; July 2019. Hangzhou, China (2019).
2、Lois Liao Jinzhi, Zhang Xi, Wang Bisheng, Li Xiaomin, Hua Younan, Fu Chao, Tee Weikok, Yee Boonhwa and Mao Songlin, Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations. the Proceedings of the ICICDT conference; 17-19 June 2019, Suzhou, China ( 2019).
1、Liao Jinzhi Lois1, Yu Minglang, Tee Weikok, Wang Bisheng, Jia Wenping, Yee Boonhwa, Zheng Haipeng, Zhang Xi, Fu Chao, Hua Younan and Li Xiaomin. COMPREHENSIVE COMPARISON OF THE WIRE BOND RELIABILITY PERFORMANCE OF CU, PDCU AND AG WIRES, CSTIC2020 Shanghai, China 18-20 March (2020).
2、Din-Ghee Neoh, Tee Weikok, Liao Jinzhi Lois, Jia Wenping, Yee Boonhwa, Boon-Seong LEE, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin, ENHANCING HIGH TEMPERATURE ADHESION PERFORMANCE VIA A RENOVATED LEADFRAME SURFACE TREATMENT, CSTIC2020, Shanghai, China 18-20 March (2020).
3、Liao Jinzhi Lois, Tee Weikok, Yu Minglang, Wang Bisheng, Zhang Xi, Yee Boonhwa, Hua Younan and Li Xiaomin, bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al, EPTC (2020), Singapore (2020).
1、Lois Jinzhi Liao, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin. Study of moisture penetration in epoxy encapsulant by deuterium oxide (D2O) The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.
2、Liao Jinzhi Lois, Wang Bisheng, Zhang Xi, Hua Younan, Li Xiaomin. Chlorine and Sulfur effects on copper wire bond reliability. the Proceedings of the 24th Electronics Packaging Technology Conference (EPTC 2022), Dec 7-9, 2022, Singapore (2022).
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