1. Project description.

TDR time domain reflectometer is a non-destructive testing technology for chip packaging. By listening to the reflected high frequency signal waveform and time consumption to determine the distance of the reflected signal, it can locate the open and short circuit location of the chip: the open and short circuit of the copper wire, bonding wire, and solder ball of the substrate, and can be used with X-Ray, CT, SAT and other non-destructive methods. Customers can provide standard samples to obtain analysis results by comparing good products, failed products and substrates

2. Application advantages.

Non-destructive analysis with standard samples for more accurate location of open circuits in BGA, SIP, SoC, QPN, TO and other packages.