DPA
1. Project introduction
DPA analyzes benefits
Component manufacturers: understand product quality, improve product design process, and reduce business risks
System Integrator: Enhance procurement quality monitoring, eliminate early hazards, and improve product reliability
DPA’s main analysis items:
1. Visual Inspection
2. X-ray inspection
3. Ultrasound examination C–SAM
4. Open Decap/Take DIE
5. Internal Inspection
6. Slice Cross-section
7. Electron microscopy SEM/EDAX
8. Pull Test
9. Bonding strength
10. Attachment strength
11. Terminal strength
12. Airproof Check
13. Integrity Inspection Passivation
14. Sampling with Microscop
15. Physical Check
16. Particle Noise PIND
17. Contact Check
18. Shear Strength Test Shear Test
DPA analysis flowchart
DPA different types of package analysis process
DPA is mainly analytical instruments and equipment
Optical Microscope
X-ray
Infrared microscope FTIR
Slice Cross section
Solder-ability
Peel strength
Stretch the tensile test
X-fluorescent surface thickness XRF/thickness
SEM/EDX spectroscopy of SEM/EDX
Shear/Pull test
SEM/EDX spectroscopy of SEM/EDX
Shear/Pull test
Thermomechanical/differential scanning analysis TMA/DSC(Tg, CTE, TD, cure factor)
Thermogravimetric analysis TGA(Td, moisture content)
Strain measurement (Heat sink process simulation)
Impedance TDR
Ultrasound scan SAT
Kaifeng De-cap
Electrical test LCR
The main analysis cases of DPA are as follows:
The case of the Hitachi SU5000 SEM
