The international conference on electronic packaging technology was held in the Lion City

Congratulations on the successful convening of the 25th IEEE Electronic Packaging Technology Conference (EPTC 2023) from December 5th to 8th, 2023, at the Grand Copthorne Waterfront Hotel in Singapore!

The 25th IEEE Electronic Packaging Technology Conference (EPTC 2023) is organized by the Singapore Chapter of the IEEE Reliability Society, Electronics Packaging Society, and Electron Devices Society. It is an international conference sponsored by the IEEE Electronics Packaging Society. Since its inception in 1997, EPTC has grown into a renowned electronics packaging technology conference in the Asia-Pacific region. Each edition of the conference attracts a large number of experts from the packaging industry worldwide.

This year’s conference has resumed its pre-pandemic grandeur, attracting over 300 participants from around the world. The conference covers various aspects of electronic packaging technology, including modules, components, materials, equipment technology, assembly, reliability, interconnect design, equipment and system packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LEDs, Internet of Things (IoT), 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and artificial intelligence. The conference features invited talks, technical sessions, keynote lectures, panel discussions, poster presentations, and interactive exchanges, providing comprehensive updates on the latest advancements in electronic packaging technology, ranging from design and manufacturing to production.

This edition of the conference has regained its pre-pandemic glory, attracting over 300 guests from around the world. The attendees have checked in at the conference registration area.

The technical organization/program committee of this grand event consists of over 100 experts from various fields of semiconductor packaging technology. They are dedicated to creating an engaging technical program for the packaging community. The conference covers a wide range of topics, including:

  1. Advanced packaging
  2. Through-Silicon Via (TSV)/wafer-level packaging
  3. Interconnect technologies
  4. Emerging technologies
  5. Materials and processes
  6. Assembly and manufacturing technologies
  7. Electrical simulation and characterization
  8. Mechanical simulation and characterization
  9. Thermal characterization and cooling solutions
  10. Quality, reliability, and failure analysis
  11. Photonics, optoelectronics, and displays
  12. Smart manufacturing and equipment technologies

In addition, the conference features four keynote speeches from industry and academic experts:

  1. Technology Trends in Advanced System Integration (Keynote Speaker: Doug Yu)
  2. 2.5D/3D Heterogeneous Integration with Silicon Photonics Engines (Keynote Speaker: Dr. Radha Nagarajan)
  3. Can Advanced Packaging Rescue Moore’s Law? (Keynote Speaker: Yang Pan)
  4. Advanced Packaging Enriches Heterogeneous Integration (Keynote Speaker: Dr. C.P. Hung)

The conference also includes a technology talk titled “Challenges in Analysis and Testing of Advanced Packaging Systems” by Dr. Mo Shakouri.

At the venue of the conference's technical talk, keynote speakers are currently sharing their achievements in the field of advanced packaging and discussing the issues and challenges they face.

The conference committee has also arranged 5 professional development courses (PDC) that attendees particularly enjoy:

  1. Fan-Out, Chiplet, and Heterogeneous Integration Packaging (by John H Lau)
  2. Flip Chip Interconnect (by Eric Perfecto)
  3. Co-Packaged Silicon Photonics: Opportunities and Challenges (by Amr S. Helmy)
  4. Design Simulation Techniques for Reliability Prediction in Advanced Packaging (by Prof. K. N. Chiang)
  5. Automotive Electronics Reliability – Challenges and Opportunities (by Pradeep Lall)

International packaging expert Eric Perfecto from IBM, who had collaborated with GlobalFoundries (Singapore fab7) several years ago, is sharing a technical course on

Additionally, this grand event has also arranged for dozens of exhibitors to showcase the latest technologies and products from leading companies in the industry. This provides an opportunity for the attending delegates to engage with cutting-edge technologies and products in the field of packaging.

The attending delegates enthusiastically engage in discussions with the exhibiting companies about the latest technologies and products.

Wintech-Nano, a provider of third-party semiconductor testing and analysis services, is dedicated to building a professional and efficient one-stop testing and analysis platform. They have been actively involved in and supporting the EPTC conference for many years. At this grand event, the expert team from Wintech-Nano presented three research and application papers:

  1. A novel method for detecting silicon crystal defects on cross-section samples (Dr. Hu Younan et al.).
  2. The influence of temperature and electrical bias on the growth of copper-aluminum intermetallic compounds (Dr. Liao Jinzhi et al.).
  3. Application of Auger electron spectroscopy in failure analysis of copper-related packaging products (Dr. Zhao Yanfei et al.).

Dr. Hu Younan, Vice President of Wintech-Nano (Singapore), and Dr. Liao Jinzhi, Director of the Research and Development Department, participated in this conference. During the conference, they had in-depth discussions and exchanges with attendees and clients from the United States, Singapore, and China.

  1. Younan Hua, Lois Liao, Linhua Zhang, Luo Xiaodan and Xiaomin Li. A Novel Silicon Crystal Defect Detection Method Using Cross-sectional Samples. The Proceedings of the 25th Electronics Packaging Technology Conference (EPTC 2023), Paper No. 300, Grand Copthorne Waterfront Hotel, Singapore,p753-755 (2023).
  1. Lois Liao, Bisheng Wang (Huawei), Xi Zhang, Younan Hua and Xiaomin Li. Effects of temperature and electrical bias on Cu-Al IMCs growth. 25th Electronics Packaging Technology Conference (EPTC 2023), Paper No. 146, Grand Copthorne Waterfront Hotel Singapore, p180-183 (2023.
  1. Yanfei Zhao, Lei Zhu, Younan Hua and Xiaomin LiApplication of Auger Electron Spectroscopy in Copper oxide Failure in Electronics Packaging. The Proceedings of the 25th Electronics Packaging Technology Conference (EPTC 2023), Paper No. 119, Grand Copthorne Waterfront Hotel, Singapore, p65-68 (2023).